Magnetron-2
Magnetron is designed for:
- sputtering of nonmagnetic metals and their alloys;
- coating thin-film coverages with irregular width no more than 5 % on substructures diameter of which up to 250 mm);
- coating coverages on semiconductor elements without accretion of imperfections.
| Cathode-target diameter, mm |
200 |
| Ion sprayer rated power, kV |
16 |
| Target utilization factor, % |
60 |
| Working gas |
argon, oxygen, nitrogen, freon |
| Working pressure range, Pa |
0,1 - 1 |
| Ion sprayer mass, kg |
20 |
Stretched magnetron
Magnetron is intended for:
- protective coating;
- decorative coating on glass, metal, ceramic, porcelain and plastic products;
- strengthening coating on cutters;
- function coating in microelectronics (conducting, resistive and insulating coating).
| Target pressure, V |
250-650 |
| Target current, À |
11,0 |
| Working pressure, Pa |
0,07-0,2 |
| Coating area length, mm |
870 or 650 |
| Film thickness irregularity, % |
±5 |
| Dimensions, mm |
1000 (or 760)õ130õ50 |
| Mass, kg |
18 (12) |
Electron beam equipment
Ion plasmic equipment
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